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Top Entry RJ45 SMT Modular Jack

"Enhanced Connectivity Solution: Introducing the Top Entry RJ45 SMT Modular Jack for Seamless Network Integration"

$500

≥1000
Piece/Pieces

Payment Type:

L/C,T/T,Paypal

Incoterm:

FOB,CIF,EXW

Min. Order:

1000 Piece/Pieces

Transportation:

Ocean,Air,Express

Port:

Shenzhen

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Product Description

Product Attributes
Supply Ability & Additional Information
Packaging & Delivery

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Overview

Product Attributes

Model No.: ATRJ5823-6P6C-X-A-X

Brand: Antenk

Place Of Origin: China

Interface Type: D-SUB(VGA)

Housing: Plastic

Pin: Brass

Poles: Other

Application: Other

Certification: CE

Gender: Male

Material: Copper

Support Card Number: Other

Operating Frequency: High Frequency

Classification: Wired Broadband Connection

Inner Packing: Tray

Supply Ability & Additional Information

Packaging: bag packing,Tube packing, reel packing

Productivity: 2000K/month

Transportation: Ocean,Air,Express

Place of Origin: China

Supply Ability: 2000K/month

Certificate: ISO 9001-2015

HS Code: 8536909000

Port: Shenzhen

Payment Type: L/C,T/T,Paypal

Incoterm: FOB,CIF,EXW

Packaging & Delivery

Selling Units:: Piece/Pieces

Package Type:: bag packing,Tube packing, reel packing

Introducing the Top Entry RJ45 SMT Modular Jack - the superhero of all Ethernet connectors! This incredible jack is here to save the day, making all your networking dreams come true. With its top entry design, it effortlessly swoops in, connecting your devices faster than a speeding bullet. Say goodbye to those frustrating moments of fumbling around to find the right angle - this jack is always ready to plug and play! Made from the finest materials, it's built to withstand even the most intense data transfers. So, why settle for ordinary jacks when you can have the Top Entry RJ45 SMT Modular Jack - the true hero of connectivity!

Top Entry Rj45 SMT Modular Jack

Specifications:

MATERIAL:

1.HOUSING MATERIAL:GLASS FILLED POLYESTER UL94V-0.
2.CONTACT MATERIAL:PHOSPHOR BRONZE t=0.35mm
3.PLATING:SELECTING GOLD PLATING
1u"~50u"OVER NICKEL IN CONTACT AREA.150u"TIN PLATING
OVER NICKEL IN SOLDER AREA.
4.SHIELD: 0.2mm THICKNESS COPPER ALLY WITH NICKEL .PLATEL
ELECTRICAL:
1.VOLTAGE PATING:125 VAC RMS.
2.CURRENT PATING:1.5 AMP
3.CONTACT RESISTANCE:30 MILLIOHMS MAX
4.INSULATION RESISTANCE:1000 MEGOHMS MIN @ 500V DC.
5.DIELECTRIC WITHSTANDING RESISTANCE:1000V AC RMS 60Hz.1MIN
MECHANICAL:
1.DURRABILITY :750 CYCLES MIN
2.PCB RETENTION PRE-SOLDER :10LB MIN
ENVIRONMENTAL:
1.STORAGE:-40℃ TO +85℃ .
2.OPERATION:-40℃ TO +85℃ .
3.IR REFLOW SOLDERING TEMPERRATURE:255~265℃(5~10 SECONDS)MATES WITH Modular Plug CONFORMING TO FCC PART 68 SUBPART F.

ATRJ5823-6P6C-X-A-X