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SMT 6P Side Entry Modular Jack

"Breaking News: SMT 6P Side Entry Modular Jack - The Secret Weapon for Bosses Who Just Can't Stop Tripping Over Cables!"

  • $500
    ≥1000
    Piece/Pieces
Payment Type:
L/C,T/T,Paypal
Incoterm:
FOB,CFR,CIF,EXW
Min. Order:
1000 Piece/Pieces
Transportation:
Ocean,Air,Express
Port:
Shenzhen
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  • Product Description
Overview
Product Attributes

Model No.ATRJ5826A-6P6C-X-A-X

BrandAntenk

Place Of OriginChina

Interface TypeD-SUB(VGA)

HousingPlastic

PinBrass

PolesOther

ApplicationOther

CertificationCE

GenderMale

MaterialCopper

Support Card NumberOther

Operating FrequencyHigh Frequency

ClassificationWired Broadband Connection

Inner PackingTray

Supply Ability & Additional Information

Packagingbag packing,Tube packing, reel packing

Productivity2000K/Month

TransportationOcean,Air,Express

Place of OriginChina

Supply Ability2000K/Month

CertificateISO 9001-2015

HS Code8536909000

PortShenzhen

Payment TypeL/C,T/T,Paypal

IncotermFOB,CFR,CIF,EXW

Packaging & Delivery
Selling Units:
Piece/Pieces
Package Type:
bag packing,Tube packing, reel packing

Introducing the SMT 6P Side Entry Modular Jack, a cutting-edge solution designed to enhance connectivity and streamline data transfer processes. This high-performance modular jack boasts a compact and durable design, perfect for demanding industrial applications. With its advanced side entry feature, it provides effortless cable insertion and secure connections, ensuring optimal signal transmission and reducing the risk of disconnection. Crafted with precision engineering, this modular jack guarantees exceptional performance and long-lasting reliability. Whether you're in telecommunications, networking, or electronics, the SMT 6P Side Entry Modular Jack is the ultimate choice for seamless connectivity and uninterrupted data flow.

SIDE ENTRY SMT JACK 6P


Specifications:

MATERIAL:
   1.HOUSING MATERIAL:GLASS FILLED POLYESTER UL94V-0.
   2.CONTACT MATERIAL :PHOSPHOR BRONZE t=0.35mm
   3.PLATING  SELECTING GOLD PLATING                                    
1u"~50u"OVER NICKEL IN CONTACT AREA.150u" TIN  PLATING
OVER NICKEL IN SOLDER AREA.
   4.SHIELD :0.25mm THICKNESS COPPER ALLY WITH NICKEL .PLATEL 
ELECTRICAL:
   1.VOLTAGE PATING :125 VAC RMS.
   2.CURRENT PATING:1.5 AMP
   3.CONTACT RESISTANCE  :35  MILLIOHMS MAX 
   4.INSULATION  RESISTANCE:1000 MEGOHMS MIN @ 500V DC.
   5.DIELECTRIC WITHSTANDING RESISTANCE: 1000V AC RMS 60Hz.1MIN
MECHANICAL:
   1.DURRABILITY:750 CYCLES MIN
   2.PCB RETENTION PRE-SOLDER :10LB MIN
ENVIRONMENTAL:
   1.STORAGE : -40℃ TO +85℃ .
   2.OPERATION: -40℃ TO +85℃ .
   3.IR REFLOW SOLDERING TEMPERRATURE:255~265℃(5~10  SECONDS)MATES WITH MODULAR PLUG CONFORMING TO FCC PART 68 SUBPART F.
ATRJ5826A-6P6C-X-A-X

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